Toshiba Electronics Europe will be showing its semiconductor, battery, data storage, and ceramic substrate products at electronica 2024 in Munich, Germany, from November 12th to 15th 2024.

Nexperia has entered into a partnership with KOSTAL, a German automotive supplier, to produce wide bandgap (WBG) devices that more closely match the exacting requirements of automotive applications.

Power Integrations has introduced a new member of its InnoMux-2 family of single-stage, independently regulated multi-output offline power supply ICs. The new device features the industry’s first 1700 ...

Navitas Semiconductor, a developer of GaN power ICs and SiC technology, has announced unaudited financial results for the ...

Allegro MicroSystems has announced a series of new power products designed to improve performance and efficiency across ...

Infineon has launched a new family of high-voltage discretes, the CoolGaN transistors 650 V G5. Target applications range from consumer and industrial switched-mode power supply (SMPS) such as USB-C ...

Sanan Semiconductor is expanding its SiC power product portfolio with the introduction of 1700V and 2000V devices for applications ranging from renewable energy to electric vehicle charging ...

Ryan Zrno, CEO of JST, discusses the ways in which the company, and the semiconductor industry more generally, is responding to the need to ensure more sustainable manufacturing alongside providing ...

Infineon Technologies is launching the new MOTIX TLE9189 gate driver IC for safety-critical applications for 12 V brushless ...

The US Department of Energy has awarded nearly $1 million to Xiaoqing Song (above), director of the University of Arkansas Power Switch Lab, to develop a prototype for high-voltage SiC power modules.

Toshiba Electronics Europe has partnered with MIKROE to integrate its Smart Motor Control Driver IC (SmartMCD) into the SmartMCD TB9M003FG board, streamlining prototyping phase for automotive ...