Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions ... collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through ...

The company is also integrating large language models ... HBM4 test chip is also pre-silicon-ready for tapeout, paving the way for future CoWoS-L solutions. The Cadence Integrity 3D-IC Platform ...