Volume Reflects Cost, Yield and Reliability Advantages of eWLB Technology and Company’s Success at Introducing it into New Markets PORTO, Portugal--(BUSINESS WIRE)-- NANIUM, a global leader in 300mm ...

STATS ChipPAC Ltd, a semiconductor test and packaging service provider, today announced it has ramped first-generation embedded wafer-level ball grid array (eWLB) technology to high-volume production.

SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging ...

VILA DO CONDE, PORTUGAL--(Marketwired - Oct 29, 2013) - NANIUM S.A., Europe's largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an ...

The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other ...

System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/83cm7r/infineon_rrn7745p) has announced the addition of the "Infineon ...

STATS ChipPAC Ltd will provide manufacturing services to Infineon Technologies AG for the company’s first-generation embedded Wafer-Level Ball Grid Array (eWLB) technology. STATS ChipPAC, a ...

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones sold in China, ...

PORTUGAL, EUROPE: Nanium S.A., Europe's largest OSAT service provider, announced the introduction of an improved dielectric material and process solution for FOWLP technology, eWLB. These improvements ...