For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

IronwoodElectronics'new high performance WLCSP socket is for 0.5 mm pitch 40 ball WLCSP and 0.4 mmpitch 30 ball WLCSP accommodated in the same socket. The SG-BGA-7203 socket isdesigned for two ...

The proliferation of electrical devices means that plug sockets are in increasing demand. Socket splitters and power strips can be used to solve this problem, but can be bulky and unsightly. An ...