TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...
Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...
A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.
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