Company: Master Bond Inc. Product: EP3HTSDA-1 Description: This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has ...

Features of Advanced Die Attach Epoxy Adhesives. The Master Bond die attach epoxy compounds are 100% reactive and do not contain any volatiles. They have excellent resistance to both thermal cycling ...

Among available die-attach materials, epoxy adhesives in particular offer a broad range of characteristics designed to meet the unique requirements of even the most specialized application. Master ...

Most silver-epoxy die attach materials have a thermal conductivity between 2 and 12 W/m-K, but there are some much higher-performance materials. There are two limiting factors for silver epoxy ...

5 Global Die Attach Equipment Market, By Bonding Technique . 5.1 Introduction 5.2 Soft Solder 5.3 Hybrid Bonding 5.4 Epoxy 5.5 Eutectic 5.6 Sintering 5.7 Mass Reflow 5.8 Thermo-Compression Bonding ...

It is also found that the die attach epoxy tends to bleed out on roughened lead frames which, in turn, means a negative impact to the device’s reliability. Hence, a die attach or lead frame treatment ...

In terms of technology, epoxy bonding dominates die attach for wire-bond packaging, and related die bonders constituted around 85% of the total bonder market in 2018. However, epoxy bonding’s share ...