Apple insider and analyst Ming-Chi Kuo has revealed a slew of new information about Cupertino's upcoming M5-series processors. The new chips are expected to power a

Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage of TSMC's latest chip-packaging technology, known as SoIC-mH.

According to reliable Apple analyst Ming-Chi Kuo, in a Medium post on Monday, Apple will utilize "server-grade SoIC [System-on-Integrated-Chip] packaging" in its M5 Pro, M5 Max, and M5 Ultra chips, excluding only the base M5 chip.

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Analyst Ming-Chi Kuo says that Apple will move away from its current processor designs that keep the CPU and GPU cores on the same chip — and see a performance gain.

Ming-Chi Kuo, a supply chain expert at TF International Securities, predicts that mass production of the M5 chip will begin in the first half of 2025. The M5 Pro and Ultra models will follow, entering production in the second half of 2025 and 2026,

The M5 chip is expected to enter mass production in H1 2025. With the Apple M4 series chips already out on the latest Macs, noted Apple analyst